http://www.luguang.cn email: lge@luguang.cn shenzhen luguang electronic technology co.,l td . 1 1. scope this specification shall cover the characteristics of the ceramic resonator with the type zttcr4.19mg. 2. part no.: part number customer part no specification no zttcr4.19mg 3. outline drawing and dimensions: appearance: no visible damage and dirt. dimensions: uint mm notes: 1.all dimensions ar e in millimeters. 2.*: eiaj monthly code. 4.19
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 2 3.4 structure no: components materials 1 outer electrodes top and bottom electrodes ag+ni(under plating)+sn(over plating) side electrodes ni+cu+ag(under plating)+sn(over plating) 2 ceramic box insulation box 3 cover dielectric material 4 inner electrodes ag 5 glue epoxy resin 6 conductive adhesive ag+epoxy resin 7 ceramic element piezoelectric ceramics (pzt)
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 3 4 rating and electrical specifications: 4.1 rating items content withstanding voltage (v) 50 (dc 1min) insulation resistance ri, ? m ?? min. 500 ? 100v 1min ? operating temperature range ( ) -25 +85 storage temperature range ( ) -55 +85 4.2 electrical specifications oscillation frequency fosc ? mhz ? 4.19 frequency accuracy ? % ? f 0.5 resonant impedance ro ? ? max. 40 temperature coefficient of oscillation frequency ? % ? max. f 0.3 ? oscillation frequency drift -25 +85 ? loop gain (db) min 10.0 rating voltage u r ? v ? max. 6v dc 15v p-p aging rate ? % ? max. f 0.2 ? for ten years ? 5 measurement: 5.1 measurement conditions: parts sh all be measured under a condition ( temp. ? 2015 ,humidity ? 6520% r.h.) unless the standard condition(temp. ? 253 ,humidity ? 655% r.h.) is regulated to measure. 5.2 test circuit: , & 1/6tc4069ubp2 x: ceramic resonator
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 4 6 physical and environmental characteristics no item condition of test performance requirements 6.1 humidity keep the resonator at 40 2 and 90-95% rh for 96h4h. then release the resonator into the room condition for 1h prior to the measurement. it shall fulfill the specifications in table 1. 6.2 vibration subject the resonator to vibration for 2h each in x ? y and z axis with the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10hz?55hz. it shall fulfill the specifications in table 1. 6.3 mechanical shock drop the resonator randomly onto a wooden floor from the height of 100cm 3 times. it shall fulfill the specifications in table 1. 6.4 soldering test passed through the re-flow oven under the following condition and left at room temperature for 1h before measurement. it shall fulfill the specifications in table 1. temperature at the surface of the substrate time preheat 150 5 60s10s peak 240 5 10s3s 6.5 solder ability dipped in 230 5 solder bath for 3s0.5s with rosin flux 25wt% ethanol solution. the terminals shall be at least 95% covered by solder. 6.6 high temperature exposure subject the resonator to 85 5 for 96h4h. then release the resonator into the room conditions for 1h prior to the measurement. it shall fulfill the specifications in table 1. 6.7 low temperature exposure subject the resonator to ?25 5 for 96h4h. then release the resonator into the room conditions for 1h prior to the measurement. it shall fulfill the specifications in table 1.
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 5 7 . physical and enviro nmenal characterisics (continued from the preceding page) no item condition of test performance requirements 6.8 temperature cycling subject the resonator to -40 for 30 min. followed by a high temperature of 85 for 30 min. cycling shall be repeated 5 times with a transfer time of 15s. at the room temperature for 1h prior to the measurement. it shall fulfill the specifications in table 1. 6.9 board bending mount a glass-epoxy board (width=40mm,thickness=1.6mm), then bend it to 1mm displacement and keep it for 5s. (see the following figure) 6 8 3 3 2 5 7 % $ 5 press head 3 5 ( 6 6 ' mechanical damage such as breaks shall not occur. table 1 item specification oscillation frequency change ? fosc/fosc (%) max 0.3 resonant impedance ( ? ) max 40 7 recommended land pattern and reflow soldering standard conditions 7.1 recommended land pattern
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 6 :land pattern 7.2 recommended reflow sold ering standard conditions within 20-40sec within 80-120sec. pre-heating within 10 sec temperature( ) 8 package to protect the products in storage and transportation it is necessary to pack them ? outer and inner package ? .on paper pack, the following requirements are requested.
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 7 8.1 dimensions and mark at the end of package, the warning (moisture proof, upward put) should be stick to it. dimensions and mark (see below) 8.2 section of package package is made of corruga ted paper with thickness of 0.8cm.package has 12 inner boxes, ea ch box has 5 reels (each reel for plastic bag). no. name quantity notes 1 package 1 2 certificate of approval 1 3 label 1 4 tying 2 5 adhesive tape 1.2m 6 belt 2.9m 7 inner box 12
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 8 8.3 quantity of package per plastic reel 3000 pi eces of piezoelectric ceramic part per inner box 5 reels per package 12 inner boxes ? 180000 pieces of piezoelectric ceramic part ? 8.4 inner packing dimensions 1 label 2 qc label 3 inner box pars shall be packaged in box w ith hold down tape upside. part no., quantity and lot no. 1.unit: mm
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 9 8.5 reel max 8.6 packing method sketch map loaded pocket leader 200mm max blank pocket 20 pitches blank pocket 20 pitches
k w w s z z z o x j x d q j f q ( p d l o o j h # o x j x d q j f q 6 + ( 1 = + ( 1 / 8 * 8 $ 1 * ( / ( & 7 5 2 1 , & 7 ( & + 1 2 / 2 * < & 2 / 7 ' . 1 0 8.7 test condition of peeling strength 10 max top tape p e e l i n g s t r e n g t h 2 0 - 7 0 g c arrier t ape 9 eiaj monthly code 2003 / 2005 / 2007 / 2009 2004 / 2006 / 2008 / 2010 month code month code jan a jan n feb b feb p ma r cma r q ap r dap r r may e may s jun f jun t jul g jul u aug h aug v sep j sep w oct k oct x nov l nov y dec m dec z 10 other 10.1 caution of use 10.1.1 do not use this product w ith bend. please don?t apply excess mechanical stress to the compone nt and terminals at soldering. 10.1.2 the component may be damage d when an excess stress will be applied. 10.1.3 this specification mentions th e quality of the component as a single unit. please insure the compone nt is thoroughly evaluated in your application circuit. 10.2 notice 10.2.1 please return one of this specification after your signature of acceptance. 10.2.2 when something gets doubtful with this specifications, we shall jointly work to get an agreement.
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